Bambu Cool Plate
Bambu Cool Plate Overview
Things to know before use
- Compatibility: X1 Series and P1P
- Variations in the color and luster of the Engineering Plate appearance and the removal of the exposed metal areas are just minor adjustments to optimize the production process and surface quality. If the coating remains on the nozzle when the nozzle is wiped, it will be heated and melted before printing the model. Such changes do not affect leveling, Lidar, adhesion, or range of use. You can purchase with confidence!
- Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.
- Bambu Lab recommends only using Bambu Lab official glue on the Cool Plate, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates.
One side: Bambu Cool Plate= Cool plate sheet + Bambu Engineering Plate
The other side: Bambu Engineering Plate
1. Bambu Cool Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Material | Hotbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
| PLA / PLA-CF / PLA-GF | 35~45℃ | Yes | Either |
| TPU | 30~35℃ | Yes | Either |
| PVA | 35~45℃ | Yes | Either |
Pros
✅ Works best with low glass transition temperature filaments as it can be used at a low temperature for the hotbed
✅ Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR
✅ Smooth texture on the surface of the print
✅ Excellent adhesion and easy print removal
✅ Can be replaced by the user
Cons
❌ Cannot be used without glue stick as the surface can be easily damaged if glue stick is not used
❌ It is not recommended for high-temperature materials as bubbles can form underneath the print surface and cause damage
❌ Can be more fragile compared to the Engineering Plate or Textured PEI Plate
2. Bambu Engineering Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Material | Hotbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
| TPU | 30~35℃ | Recommended | No |
| PETG | 70~80℃ | Recommended | Yes |
| ABS | 100~110℃ | Yes | No |
| PC / PC-CF | 100~110℃ | Yes | No |
| PA / PA-CF / PATH-CF | 100~110℃ | Recommended | No |
Installation Steps
Step 1: Align the plate with the fixed points of the platform with the name of the plate facing you
Step 2: Lower the plate and secure to the magnetic platform
Product Specifications
- Surface Temperature REsistance: Up to 120℃
- Flexible spring steel thickness: 0.5 mm
- Usable print size: 256*256 mm
- Cool Plate sticker thickness: 0.4 mm
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